Nā palapala hōʻoia
Mai Mei 2018, ua hoʻokō mākou i ka hoʻolālā patent ma ka pae honua.I kēia manawa, ua noi aku ʻo LEME i ʻoi aku ma mua o 30 mau patent ma nā ʻano o ka hoʻolālā lāʻau paka wela, ka hoʻolālā mea kōkua, nā mea hana lāʻau, etc.
ʻO LEME ka hui mua i noi no ka "granular five-element stick structure" ma ke ʻano he patent invention core.ʻO ka papa hana ʻelima e pili ana i ka pepa sealing, nā granules non-homogenized, ka pale firmware, ka ʻāpana hollow a me ke koʻokoʻo kānana.Ua hoʻohana ʻia ka patent core stick structure ma 41 mau ʻāina.